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Bergquist Co. |
Bond-Ply 100 |
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Thermal materials |
Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape |
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Bergquist Co. |
Bond-Ply 400 |
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Thermal materials |
Thermally Conductive, Unreinforced, Pressure Sensitive Adhesive Tape |
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Bergquist Co. |
Bond-Ply 660P |
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Thermal materials |
Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape |
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Bergquist Co. |
Bond-Ply 800 |
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Thermal materials |
Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape |
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Bergquist Co. |
Bond-Ply LMS 500P |
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Thermal materials |
Thermally Conductive, Polyimide Reinforced, Laminate Material-Silicone |
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Bergquist Co. |
Bond-Ply LMS-HD |
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Thermal materials |
Laminate Material - Silicone, High Durability, Optional Lamination Methods |
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Bergquist Co. |
Gap Filler 1000 (Two-Part) |
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Thermal materials |
Thermally Conductive, Liquid Gap Filling Material |
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Bergquist Co. |
Gap Filler 1000SR (Two-Part) |
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Thermal materials |
Thermally Conductive, Superior Slump Resistance, Liquid Gap Filling Material |
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Bergquist Co. |
Gap Filler 1100 SF (Two-Part) |
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Thermal materials |
Thermally Conductive, Silicone-Free, Liquid Gap Filling Material |
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Bergquist Co. |
Gap Filler 1400 SL |
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Thermal materials |
Thermally Conductive, Silicone-Free, Liquid Gap Filling Material |
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Bergquist Co. |
Gap Filler 1500 (Two-Part) |
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Thermal materials |
A two-part, high performance, thermally conductive liquid gap filling material. |
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Bergquist Co. |
Gap Filler 1500LV |
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Thermal materials |
A two-part, high performance, thermally conductive liquid gap filling material. |
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Bergquist Co. |
Gap Filler 2000 (Two-Part) |
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Thermal materials |
High Thermally Conductive, Liquid Gap Filling Material |
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Bergquist Co. |
Gap Filler 3500 LV (Two-Part) |
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Thermal materials |
Thermally Conductive Liquid Gap Filling Material |
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Bergquist Co. |
Gap Filler 3500S35 (Two-Part) |
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Thermal materials |
Thermally Conductive Liquid Gap Filling Material |
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Bergquist Co. |
Gap Filler 4000 |
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Thermal materials |
Thermally Conductive Liquid Gap Filling Material |
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Bergquist Co. |
Gap Pad 1000HD |
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Thermal materials |
Thermally Conductive, Highly Conformable Gap Filling Material |
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Bergquist Co. |
Gap Pad 1000SF |
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Thermal materials |
Thermally Conductive, Silicone-Free Gap Filling Material |
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Bergquist Co. |
Gap Pad 1450 |
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Thermal materials |
Highly Conformable, Thermally Conductive Material for Filling Air Gaps |
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Bergquist Co. |
Gap Pad 1500 |
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Thermal materials |
Thermally Conductive, Unreinforced Gap Filling Material |
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Bergquist Co. |
Gap Pad 1500R |
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Thermal materials |
Thermally Conductive, Reinforced Gap Filling Material |
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Bergquist Co. |
Gap Pad 1500S30 |
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Thermal materials |
Highly Conformable, Thermally Conductive, Reinforced "S-Class" Gap Filling Material |
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Bergquist Co. |
Gap Pad 2000S40 |
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Thermal materials |
Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material |
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Bergquist Co. |
Gap Pad 2200SF |
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Thermal materials |
Thermally Conductive, Silicone-Free Gap Filling Material |
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Bergquist Co. |
Gap Pad 2202SF |
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Thermal materials |
Silicone-Free Formulation, High Performance Thermally Conductive Material |
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Bergquist Co. |
Gap Pad 3004SF |
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Thermal materials |
High Performance, Thermally Conductive Material With Silicone-Free Formulation |
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Bergquist Co. |
Gap Pad 3500ULM |
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Thermal materials |
Highly Conformable, Thermally Conductive, Ultra-Low Modulus Material |
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Bergquist Co. |
Gap Pad 5000S35 |
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Thermal materials |
High thermal conductivity plus "S-Class" softness and conformability. |
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Bergquist Co. |
Gap Pad A2000 |
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Thermal materials |
High Performance, Thermally Conductive Gap Filling Material |
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Bergquist Co. |
Gap Pad A3000 |
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Thermal materials |
Thermally Conductive, Reinforced Gap Filling Material |
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Bergquist Co. |
Gap Pad EMI 1.0 |
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Thermal materials |
Thermally Conductive, Conformable EMI Absorbing Material |
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Bergquist Co. |
Gap Pad HC1000 |
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Thermal materials |
“Gel-Like” Modulus Gap Filling Material |
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Bergquist Co. |
Gap Pad HC3.0 |
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Thermal materials |
Highly Conformable, Thermally Conductive, Low Moduls Material |
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Bergquist Co. |
Gap Pad VO |
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Thermal materials |
Conformable, Thermally Conductive Material for Filling Air Gaps |
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Bergquist Co. |
Gap Pad VO Soft |
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Thermal materials |
Highly Conformable, Thermally Conductive Material for Filling Air Gaps |
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Bergquist Co. |
Gap Pad VO Ultra Soft |
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Thermal materials |
Ultra Conformable, Thermally Conductive Material for Filling Air Gaps |
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Bergquist Co. |
Gap Pad VO Ultra Soft Black |
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Thermal materials |
Ultra Conformable, Thermally Conductive Material for Filling Air Gaps |
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Bergquist Co. |
Hi-Flow 105 |
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Thermal materials |
Phase Change Coated Aluminum |
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Bergquist Co. |
Hi-Flow 225 |
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Thermal materials |
F-AC Reinforced, Phase Change Thermal Interface Material |
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Bergquist Co. |
Hi-Flow 225U |
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Thermal materials |
Non-Reinforced Phase Change Thermal Interface Material |
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Bergquist Co. |
Hi-Flow 225UT |
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Thermal materials |
Non-Reinforced, Pressure Sensitive Phase Change Thermal Interface Material |
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Bergquist Co. |
Hi-Flow 300G |
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Thermal materials |
Fiberglass-Reinforced, Phase Change Thermal Interface Material |
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Bergquist Co. |
Hi-Flow 300P |
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Thermal materials |
Electrically Insulating,Thermally Conductive Phase Change Material |
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Bergquist Co. |
Hi-Flow 330P |
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Thermal materials |
Electrically Insulating, High Performance, Thermally Conductive Phase Change Material |
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Bergquist Co. |
Hi-Flow 565U |
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Thermal materials |
High Performance, Unreinforced Phase Change Thermal Interface Material |
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Bergquist Co. |
Hi-Flow 565UT |
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Thermal materials |
Tacky, High Performance, Unreinforced Phase Change Thermal Interface Material |
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Bergquist Co. |
Hi-Flow 625 |
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Thermal materials |
Electrically Insulating, Thermally Conductive Phase Change Material |
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Bergquist Co. |
Hi-Flow 650P |
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Thermal materials |
Electrically Insulating, High Performance, Thermally Conductive Phase Change Material |
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Bergquist Co. |
Liqui Bond SA 1000 (one-part) |
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Thermal materials |
Thermally Conductive, One-Part, Liquid Silicone Adhesive |
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Bergquist Co. |
Liqui Bond SA 2000 (one-part) |
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Thermal materials |
Thermally Conductive, One-Part, Liquid Silicone Adhesive |
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Bergquist Co.